Select Case Studies

Product Robustness

Product Robustness

MSL Improvement of High Density Power Converters:

Examined the high density power converters manufacturing and assembly line of a semiconductor company to look for potential weak links and inefficiencies.  Analyzed the failure modes of the product line and determined the root cause.  Provided a complete solution and improvement plan that included use of new technologies, and recommended potential changes to material sets and the manufacturing processes to the Executive Management team.

 

RoHS Product Conversion for RF Components

Managed end-to-end RoHS packaging initiatives for RF modules (multiple substrates) from R&D to production. Selected and evaluated packaging materials such as solder paste, die attach, solder mask, overmold, laminate technology, and leadframe plating, in accordance with Leadfree/RoHS guidelines by working with multiple subcons.

Performed ALL RoHS qualification tests such as MSL, HAST, TCT, THB & Solderability tests for all packages to ensure compliance.  Project resulted in a new RoHS compliant product line resulting in new Tier 1 Customers.


Product Assembly

Product Assembly

Manufacturing of High Integrity/Reliability/Low Cost Power Devices

Provided expertise on all aspects of back-end manufacturing including SMT attach, Flip chip Attach, Underfill, Curing, Molding, and Singulation to ensure high reliability/low cost product development for a Multi-National Semiconductor Organization.  Focused on Design Aspects, Material Selection, and Manufacturing Process improvements. 

 

SiP Manufacturing House Selection for High Q RF Component Developing Startup

Successfully selected multiple US based and International Substrate/PCB manufacturing houses, assembly houses, and Copper Pillar / Bar (bread loaves) bumping houses for flip-chip bumping for building all prototypes as a first step for high volume manufacturing.  Additionally researched and evaluated alternate substrate and packaging technologies for future products including embedded components, stacked die/Flip-stack, double-sided assembly.

 


Failure Analysis

Failure Analysis

Root cause analysis for On-going Production and Reliability Failures

Mold Delamination Project: Successfully led a team of managers and senior engineers from various departments to successfully determine root cause of Mold blisters on V•I Chips. Project resulted in an annual savings of over $3M.

Solder Shorting Project: Managed several projects with Design, Manufacturing and QA to determine root causes of various solder related failure modes.  Considered the #1 failure mode and projects have resulted in 66% success rate to date.

Silver Migration Project: Managing the conversion of the mold compound & die attach epoxy across all RF SiPs to make the products more robust during biased reliability test and eliminate silver migration.


Project Finances

Project Finances

Cost Saving Initiatives

Substrate Evaluation: Managed on-going project for evaluating and qualifying a new thinner laminate substrate for high power and higher thermal RF Multichip SiPs.  Evaluated/Audited various laminate manufacturers as a cost saving measure. Determined selection criteria such as current capabilities, quality, service, and technology roadmap to be used as a baseline for all future audits.

I/O Plating Evaluation: Evaluated, qualified, and implemented the ENEPIG process as a suitable replacement for ENAG as a surface finish across all SiPs as a cost saving initiative for RF Power Amplifiers.

Moisture Absorption: Analyzed the Moisture Absorption/Desorption rates of various Molding compounds on various Laminate Packages in accordance to JEDEC standards.  Determined the optimal drying time & established the drying criterion for products prior to shipment to customers.  Project reduced the overall time by over 66%.


Seminars

Seminars

IC Packages Quality and Reliability Course

Presented a three day course at the Selangor Human Resource Development Centre (SSRDC).  Audience included Engineers and Technical Managers from Carsem, Unisem, & Intel.